DRIE Etcher
DRIE(Deep Reactive Ion Etching) Etcher is an equipment that etches Si on a micrometer-scale by controlling plasma and used for several advanced packaging processes such as TSV for 3DIC, DTI for high-power PMIC, BSI for CIS and etc. GigaLane developed DRIE etcher by utilizing its unique plasma source and controlling technology as well as TSV process recipe cumulated from its own MEMS fab.
- NeoS-MAXIS™200
- • 4-8 inch semi-auto transfer system
- • 1 trasfer chamber, 1 process chamber
- • Cycle & non-cycle process available
- NeoGEN-MAXIS™200
- • 4-8 inch semi-auto transfer system
- • 1 trasfer chamber, 1 process chamber
- • Cycle & non-cycle process available
- NeoGENⅡ-MAXIS™200
- • 8 inch silicon or glass wafer
- • Hexagonal cluster
- • 3 process chambers
- • Cycle & non-cycle process available
- NeoⅢ-MAXIS™300
- • 12 inch silicon or glass wafer
- • Hexagonal cluster
- • 4 process chambers
- • Cycle & non-cycle process available
* Click above images to see more information of each products.